Gallium arsenide/gold flip-chip connection stress fields

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Su, Bingzhi ^a   Labossiere, Paul E W ^a   Dunn, Martin L ^a   Lee, Y C ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BRITTLENESS; CRACK INITIATION; ELASTOPLASTICITY; FLIP CHIP DEVICES; GOLD; INTERFACES (MATERIALS); SEMICONDUCTING GALLIUM ARSENIDE; STRESS ANALYSIS; THERMAL EXPANSION;

THERMAL EXPANSION MISMATCH;

ELECTRONICS PACKAGING;

EID: 0342297961     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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