Effect of underfill on the pressure cooker test performance of flip chip on board assembly

American Society of Mechanical Engineers, EEP

Volumn 26, Issue , 1999, Pages

  Huang, Yu Wen ^a   Teo, Keng Hwa ^a   Chua, Khoon Lam ^a   Yang, Michael W R ^b   Ferng, William ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b CIBA GEIGY LTD   (Switzerland)

^c Ciba Specialty Chemicals   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; INTEGRATED CIRCUIT TESTING; PRESSURIZATION; SOLDERED JOINTS; STRAIN; THERMAL CYCLING;

FLIP CHIP ON BOARD (FCOB); PRESSURE COOKER TESTS (PCT);

ELECTRONICS PACKAGING;

EID: 0342297921     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Lehamnn, G. L., Driscoll, T., Cuydosh, N. R., Li, P. C., and Cotts, E. J., 1998, "Underflow Process for Direct-Chip-Attachment Package," IEEE Transactions - Components, Packaging, and Manufacturing Technology: Part A, Vol. 21, No. 2, pp.266-274.
2. Lau, J. and Pao, Y., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw Hill, New York, New York.
3. Schwiebert, M. K., and Leong, W. H., 1996, "Underfill Flow as Viscous Flow between Parallel Plates Driven by Capillary Action," IEEE Transactions - Components, Packaging, and Manufacturing Technology: Part C, Vol. 19, No. 2, pp.133-137.
4. th Electronic Components & Technology Conference, Seattle, Washington, pp.1098-1102.
5. Wong, C. P., Segelken, J. M., and Robinson, C. N., 1994, "Chip on Board Encapsulation" in Lau, J. (Ed) Chip on Board Technologies for Multichip Modules, Van Nostrand Reinhold, New York, New York.