Characterization of Dielectric Materials Using a High-Resolution Scanning Kelvin Microprobe

Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report

Volumn , Issue , 2003, Pages 16-19

  Cheran, Larisa Emilia ^a   Lam, Patrick ^a   Zheng, Zhong ^a   Boggs, Steven ^a   Thompson, Michael ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTRIC CONTACTS; ELECTRODES; MICROSTRUCTURE; PERMITTIVITY; SELF ASSEMBLY; SURFACE TOPOGRAPHY;

HIGH RESOLUTION SCANNING KELVIN MICROPROBES;

ELECTRIC INSULATION;

EID: 0242676036     PISSN: 00849162     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. L-E.Cheran, H-D.Liess, M. Thompson, The Analyst, 1999, 124, 961
2. L.-E. Cheran, M. E. McGovern, M. Thompson, Faraday Discuss, 2000, 116, pp. 23-34.
3. Cao, Y., G.G. Jiang, and S.A. Boggs. "High Field Measurements with a Guarded Needle". IEEE Electrical Insulation Magazine. Vol. 19, No. 3, May/June 2003.