Cu and dilute binary Cu(Ti), Cu(Sn) and Cu(Al) thin films: Texture, grain growth and resistivity

Materials Research Society Symposium - Proceedings

Volumn 721, Issue , 2002, Pages 61-66

  Gungor, A ^a   Barmak, K ^a   Rollett, A D ^a   Cabral Jr , C ^b   Harper, J M E ^b  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; COPPER; ELECTRIC CONDUCTIVITY; GRAIN GROWTH; TEXTURES;

METAL INTERCONNECTIONS;

THIN FILMS;

EID: 0036458481     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-721-j3.2     Document Type: Conference Paper

References (3)

1. J.M.E. Harper and K.P. Rodbell, J. Vac. Sci. Technol. B15, 763 (1997).
2. K. Barmak, G.A. Lucadamo, C. Cabral, Jr., C. Lavoie, and J.M.E. Harper, J. Appl. Phys. 87, 2204 (2000).
3. Scion Image, http://www.scioncorp.com.