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Volumn 13, Issue 1, 1997, Pages 3-8

'Smart' electronic systems for condition-based health management

Author keywords

Condition monitoring; Electronic systems; Health management; Physics of failure

Indexed keywords

ELECTRONICS ENGINEERING; FAILURE ANALYSIS; MAINTENANCE; MANAGEMENT; MONITORING; PRINTED CIRCUITS;

EID: 0030734436     PISSN: 07488017     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1099-1638(199701)13:1<3::AID-QRE54>3.0.CO;2-D     Document Type: Article
Times cited : (16)

References (10)
  • 1
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    • MEMS for smart structures
    • M. Mehregany and C. Bang, 'MEMS for smart structures', Proceedings of SPIE, 2448, 105-114 (1993).
    • (1993) Proceedings of SPIE , vol.2448 , pp. 105-114
    • Mehregany, M.1    Bang, C.2
  • 3
    • 0026374740 scopus 로고
    • Material failure mechanisms and damage models
    • A. Dasgupta and M. Pecht, 'Material failure mechanisms and damage models', IEEE Transactions on Reliability, 40, (5), 531-536 (1991).
    • (1991) IEEE Transactions on Reliability , vol.40 , Issue.5 , pp. 531-536
    • Dasgupta, A.1    Pecht, M.2
  • 4
    • 0942269747 scopus 로고
    • Structural health assessment and review program (SHARP): Prototype of an on-board structural health monitoring system
    • J. Gentry, C. VanWay, C. Marantidis and J. Kudva, 'Structural health assessment and review program (SHARP): prototype of an on-board structural health monitoring system', Proceedings of SPIE, 1917, 1020-1027 (1993).
    • (1993) Proceedings of SPIE , vol.1917 , pp. 1020-1027
    • Gentry, J.1    Vanway, C.2    Marantidis, C.3    Kudva, J.4
  • 5
    • 0026966054 scopus 로고
    • Are components still the major problem: A review of electronic system and device field failure returns
    • M. Pecht and V. Ramappan, 'Are components still the major problem: a review of electronic system and device field failure returns', IEEE Transactions on Components, Hybrids and Manufacturing Technology, 15, (6), 1160-1164 (1992).
    • (1992) IEEE Transactions on Components, Hybrids and Manufacturing Technology , vol.15 , Issue.6 , pp. 1160-1164
    • Pecht, M.1    Ramappan, V.2
  • 6
    • 0028512717 scopus 로고
    • Failure mechanism models for conductive filament formation
    • B. Rudra and D. Jennings, 'Failure mechanism models for conductive filament formation', IEEE Transactions on Reliability, 43, (3), 354-360 (1994).
    • (1994) IEEE Transactions on Reliability , vol.43 , Issue.3 , pp. 354-360
    • Rudra, B.1    Jennings, D.2
  • 7
    • 85081471638 scopus 로고
    • Experimental and analytical investigation in Aramid PWBs - Part 2
    • June
    • D. Yoder, S. Bhandarkar and A. Dasgupta, 'Experimental and analytical investigation in Aramid PWBs - Part 2', IPC Review, June 1993, pp. 20-27.
    • (1993) IPC Review , pp. 20-27
    • Yoder, D.1    Bhandarkar, S.2    Dasgupta, A.3
  • 8
    • 0026839534 scopus 로고
    • Influence of selected design variables on thermo-mechanical stress distributions in plated-through-hole structures
    • S. Bhandarkar, A. Dasgupta, D. Barker, M. Pecht and W. Engelmaier, 'Influence of selected design variables on thermo-mechanical stress distributions in plated-through-hole structures', ASME Journal of Electronic Packaging, 114, 8-13 (1992).
    • (1992) ASME Journal of Electronic Packaging , vol.114 , pp. 8-13
    • Bhandarkar, S.1    Dasgupta, A.2    Barker, D.3    Pecht, M.4    Engelmaier, W.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.