Thermal Analysis of Micromirrors for High-Energy Applications

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 3, 2003, Pages 310-317

  Zhang, Jianglong ^a   Lee, Yung Cheng ^b   Tuantranont, Adisorn ^c   Bright, Victor M ^b  

^a Reflectivity Inc   (United States)

^b University of Colorado at Boulder   (United States)

^c NATIONAL ELECTRONICS AND COMPUTER TECHNOLOGY CENTER   (Thailand)

Author keywords

Finite element; Microelectromechanical systems (MEMS); Micromirror; Thermal analysis

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT CONDUCTION; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; THERMOANALYSIS;

HIGH-ENERGY APPLICATIONS;

MIRRORS;

EID: 0142196099     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.818050     Document Type: Article

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