Nanoparticles to Improve Mass Transport Inside Deep Recesses

Electrochemical and Solid-State Letters

Volumn 6, Issue 11, 2003, Pages

  Panda, A ^a   Podlaha, E J ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY LAYERS; DEPOSITION; ELECTRODES; ELECTROLYTES;

X-RAY RADIATION;

NANOSTRUCTURED MATERIALS;

EID: 0142188702     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1614452     Document Type: Article

References (36)

1. A. Brenner, Electrodeposition of Alloys, Academic Press, New York (1963).
2. M. Musiana, Electrochim. Acta, 45, 3397 (2000).
3. J. P. Cells and J. R. Roos, in Reviews on Coatings and Corrosion, Vol. 5, R. N. Parkins, Editor, Freund Publ. House Ltd., Tel-Aviv (1982).
4. A. Hovestad and L. J. J. Janssen, J. Appl. Electrochem., 25, 519 (1995).
5. R. Narayan and B. H. Narayana, in Reviews on Coatings and Corrosion, Vol. 4, p. 1, J. Yahalom, Editor, Freund Publ. House Ltd., Tel-Aviv (1979).
6. C. Kerr, D. Barker, F. Walsh, and J. Archer, Trans. Inst. Met. Finish., 78, 171 (2000).
7. K. V. Quang, E. Chassaing, and B. L. Viet, Met. Finish., 1985, 10.
8. V. P. Greco and W. Baldauf, Plating, 55, 250 (1968).
9. M. H. Fawzy, M. M. Ashour, and A. M. Abd El-Halim, Trans. Inst. Met. Finish., 73, 132 (1995).
10. J. P. Celis, H. Kelchtermans, and J. R. Roos, Trans. Inst. Met. Finish., 56, 41 (1977).
11. G. R. Lakshminarayanan, E. S. Chen, and F. K. Sautter, Plat. Surf. Finish., 1976, 35.
12. A. Ramasamy and M. Totlani, J. Electrochem. Soc. India, 26-2, 25 (1977).
13. X. M. Ding, M. Merk, and B. Ilschner, J. Mater. Sci., 33, 803 (1998).
14. F. K. Sautter, J. Electrochem. Soc., 110, 557 (1963).
15. J. Steinbach and H. Ferkel, Scr. Mater., 44, 1813 (2001).
16. M. Verelst, J. P. Bonino, and A. Rousset, Mater. Sci. Eng., A, 135, 51 (1991).
17. Y.-S. Chang and J.-Y. Lee, Mater. Chem. Phys., 20, 309 (1988).
18. H. Ferkel, B. Muller, and W. Riehemann, Mater. Sci. Eng., 234, 476 (1997).
19. M. A. Lavanant, J. Appl. Electrochem., 25, 1113 (1995).
20. H. Hayashi, S. Y. Izumi, and I. Tari, J. Electrochem. Soc., 140, 362 (1993).
21. A. M. J. Kariapper and J. Foster, Trans. Inst. Met. Finish., 52, 87 (1974).
22. P. Webb and N. Robertson, J. Electrochem. Soc., 141, 669 (1994).
23. J. L. Stojak and J. B. Talbot, J. Appl. Electrochem., 31, 559 (2001).
24. W. Ehrfeld, V. Hessel, H. Lowe, Ch. Schulz, and L. Weber, Materials of LIGA Technology, Microsystems Technologies, Vol. 5, p. 105, Springer-Verlag, Heidelberg (1999).
25. S. H. Yeh, C. Y. Liue, J. W. Wang, M. C. Chou, and S. L. Hou, Proc. SPIE, 3223, 82 (1997).
26. T. Wang, Ph.D. thesis, Louisiana State University, Baton Rouge, LA (1999).
27. C. Jakob, F. Erler, R. Nutsch, S. Steinhauser, B. Wielage, and A. Zschunke, in Compound Semiconductor Power Transistors II and SOTAPOCS XXXII, A. G. Baca and R. F. Kopf, Editors, PV 2000-1, p. 329, The Electrochemical Society Proceedings Series, Pennington, NJ, (2000).
28. V. K. P. Kanigicheria, K. W. Kelly, E. Ma, W. Wang, and M. C. Murphy, Microsyst. Technol., 4, 77 (1998).
29. E. W. Becker, W. Ehrfeld, P. Hagman, A. Mauer, and D. Muchmayer, Microelectron. Eng., 4, 34 (1986).
30. R. H. Nilson and S. K. Griffiths, Proc. SPIE, 14174, Paper 5 (2000).
31. H. Vogt, Electrochim. Acta, 23, 203 (1978).
32. H. Vogt, Electrochim. Acta, 32, 633 (1987).
33. P. K. Andersen, R. H. Miller, and C. W. Tobias, J. Electrochem. Soc., 136, 390 (1989).
34. D. W. Gibbins, R. H. Muller, and C. W. Tobias, J. Electrochem. Soc., 138, 3255 (1991).
35. M. Marie de Ficquelmont-Loizos, L. Tamisier, and A. Caprani, J. Electrochem. Soc., 135, 626 (1988).
36. A. Caprani, M. Marie de Ficquelmont-Loizos, L. Tamisier, and P. Peronneau, J. Electrochem. Soc., 135, 635 (1988).