Effect of tensile strain on adatom diffusion on Cu(1 1 1) surface

Surface Science

Volumn 545, Issue 1-2, 2003, Pages 137-142

  Wang, Y X ^a   Pan, Z Y ^a   Li, Z J ^a   Wei, Q ^a   Zang, L K ^a   Zhang, Z X ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

Adatoms; Copper; Molecular dynamics; Surface diffusion; Surface stress

Indexed keywords

COPPER; DIFFUSION; STRAIN; TENSILE PROPERTIES;

TENSILE STRAIN;

SURFACE PROPERTIES;

EID: 0142075331     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.susc.2003.09.005     Document Type: Article

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