Electron tomography of inlaid copper interconnect structures

Microscopy and Microanalysis

Volumn 9, Issue SUPPL. 3, 2003, Pages 270-271

  Stegmann, Heiko ^a   Engelmann, Hans Jürgen ^a   Zschech, Ehrenfried ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0142027672     PISSN: 14319276     EISSN: None     Source Type: Journal    
DOI: 10.1017/s1431927603023286     Document Type: Conference Paper

References (3)

1. Mardinly, J. in Proc. Microscop. and Microanal. 2001 Meeting (MSA, Long Beach, 2001).
2. Stegmann, H., Engelmann, H. & Zschech, E. Microelectron. Eng. 65, 171-183 (2003).
3. Owen, C. & Landis, W. Ultramicroscopy 63(1), 27-38 (1996).