Thickness scaling issues of Ni silicide

Microelectronic Engineering

Volumn 70, Issue 2-4, 2003, Pages 201-208

  Chamirian, O ^a,b   Kittl, J A ^a   Lauwers, A ^a   Richard, O ^a   Van Dal, M ^c   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

^c PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

NiSi; Sheet resistance; Thermal stability; Thickness scaling

Indexed keywords

ACTIVATION ENERGY; AGGLOMERATION; PYROLYSIS; THERMODYNAMIC STABILITY;

SHEET RESISTANCE;

NICKEL COMPOUNDS;

EID: 0142011595     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(03)00366-6     Document Type: Conference Paper

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