PCB EMC design guidelines: A brief annotated list

IEEE International Symposium on Electromagnetic Compatibility

Volumn 1, Issue , 2003, Pages 34-36

  Hubing, Todd ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE; ELECTROMAGNETIC WAVE INTERFERENCE; EVALUATION; INTEGRATED CIRCUIT LAYOUT; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; SPURIOUS SIGNAL NOISE;

DESIGN GUIDELINES; TRACE ROUTING;

ELECTROMAGNETIC COMPATIBILITY;

EID: 0141940122     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. D. Hockanson et al., "Investigation of fundamental EMI source mechanisms driving common-mode radiation from printed circuit boards with attached cables," IEEE Transactions on Electromagnetic Compatibility, vol. EMC-38, no. 4, Nov. 1996, pp. 557-566.
2. T. Hubing, et al., "Power bus decoupling on multilayer printed circuit boards," IEEE Transactions on Electromagnetic Compatibility, vol. EMC-37, no. 2, May 1995, pp. 155-166.
3. T. Hubing, et al., "An Experimental Investigation of 4-Layer Printed Circuit Board Decoupling," Proceedings of the 1995 IEEE International Symposium on Electromagnetic Compatibility, Atlanta, GA, August 1995, pp. 308-312.
4. J. Fan, et al., "Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs," IEEE Transactions on Electromagnetic Compatibility, vol. EMC-43, no. 4, Nov. 2001, pp. 588-599
5. T. Zeeff, et al., "Analysis of simple two-capacitor lowpass filters," to appear in the IEEE Transactions on Electromagnetic Compatibility.