Reliability assessment of fielded plastic and hermetically packaged microelectronics

IEEE Transactions on Reliability

Volumn 45, Issue 1, 1996, Pages 23-26

  Johnson, Bruce ^a,b   Verma, Vani ^a,b  

^a Honey Well

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

Hermetically sealed microcircuit; Plastic encapsulated microcircuit

Indexed keywords

FAILURE ANALYSIS; INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; RELIABILITY;

HERMETICALLY SEALED MICROCIRCUITS; PLASTIC ENCAPSULATED MICROCIRCUITS;

ELECTRONICS PACKAGING;

EID: 0030104395     PISSN: 00189529     EISSN: None     Source Type: Journal    
DOI: 10.1109/24.488911     Document Type: Article

References (3)

1. M. Pecht, R. Agarwal, D. Quearry, "Plastic packaged microcircuits: Quality, reliability, and cost issues", IEEE Trans. Reliability, vol 42, 1993 Dec, pp 513-517.
2. M. Pecht, L. Nyguen, E. Hakim, Plastic Encapsulated Microcircuits, 1995; John Wiley & Sons.
3. F. Malver, B. Johnson, Plastic Packaging Availability Program, 1995 May 15.