Magnetic effect during copper electrodeposition: Diffusion process considerations

Journal of Physical Chemistry B

Volumn 107, Issue 35, 2003, Pages 9459-9464

  Fricoteaux, P ^a   Jonvel, B ^a   Chopart, J P ^a  

^a UNIVERSITÉ DE REIMS CHAMPAGNE ARDENNE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION IN SOLIDS; ELECTRODES; ELECTRONS; ELECTROPLATING; KINEMATICS; MAGNETIC FIELD EFFECTS; SULFURIC ACID; VISCOSITY;

COPPER ELECTRODEPOSITION; ELECTRON NUMBER; KINEMATIC VISCOSITY; MAGNETOCONVECTION;

ELECTRODEPOSITION;

EID: 0141794660     PISSN: 15206106     EISSN: None     Source Type: Journal    
DOI: 10.1021/jp0305537     Document Type: Article

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