Laser drilling speeds BGA packaging

Solid State Technology

Volumn 39, Issue 9, 1996, Pages 120-128

  Lizotte, Todd ^a,c   Ohar, Orest ^a,d   O'Keefe, Terence ^a,d   Kelly, Chris ^b  

^a Neuman MicroTechnologies   (United States)

^b Solas   (United States)

^c Micro Technologies Incorporated   (United States)

^d Neuman Microtechnologies ^*

Author keywords

[No Author keywords available]

Indexed keywords

EXCIMER LASERS; INTEGRATED CIRCUIT MANUFACTURE; LASER APPLICATIONS; MICROMACHINING; MULTICHIP MODULES; SURFACE MOUNT TECHNOLOGY;

BALL GRID ARRAY (BGA) PACKAGING;

ELECTRONICS PACKAGING;

EID: 0030223082     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

1. D. J. Elliott, Integrated circuit fabrication technology, Second Edition, McGraw Hill (1993).
2. H. Frerichs, J. D. A. Tricker, E. W. Kreutz, "Laser-induced surface modification and metallization of polymers," Applied Surface Science, vol. 86 (Feb. 1995).
3. H. G. Muller, Y. Yuan, R. E. Sheets, "Large area fine line patterning by scanning projection lithography," IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B: Advanced Packaging, vol. 18, no. 1 (Feb. 1995).
4. Lambda Physik "Highlights," no. 43 (Jan. 1994).
5. Lambda Physik "Highlights," no. 48 (Nov. 1994).
6. L. Migliore, "Laser materials processing," first edition, Marcel Dekker (1996).
7. C. P. Christensen, "Capabilities of low power excimer lasers in micromachining," Conf. Proc., Lasers and Electro-Optics Society Annual Meeting, IEEE (1993).
8. A. C. Engelsberg, Proc. of the Materials Research Society, eds. G. Higashi, G. Irene, T. Ohmi, Pittsburgh, PA, vol. 315 (1993).