Tungsten/copper composite deposits produced by a cold spray

Scripta Materialia

Volumn 49, Issue 12, 2003, Pages 1169-1174

  Kang, Hyun Ki ^a   Kang, Suk Bong ^a  

^a Korea Institute of Machine and Materials   (South Korea)

Author keywords

Cold spray; Electronic package application; Tungsten copper composite

Indexed keywords

CARBON STEEL; COMPOSITE MATERIALS; OXIDATION; PLASMA SPRAYING;

COLD SPRAY;

TUNGSTEN COMPOUNDS;

EID: 0141733257     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2003.08.023     Document Type: Article

References (11)

1. Smith R., Knight R. JOM. 47:1995;32.
2. Lima R.S., Karthikeyan J., Kay C.M., Lindenman J., Berndt C.C. Thin Solid Films. 416:2002;129.
3. Van Steenkiste T.H., Smith J.R., Teets R.E., Moleski J.J., Grokiewicz D.W., Tison R.P.et al. Surf. Coat. Technol. 111:1999;62.
4. McCune R.C., Donlon W.T., Popoola O.O., Carwright E.L. J. Thermal Spray Technol. 9:2000;73.
5. Gilmore D.L., Dykhuzen R.C., Neiser R.A., Roemer T.J., Smith M.F. J. Thermal Spray Technol. 8:1999;576.
6. Sasaki K., Shimizu Y. J. Thermal Spray Technol. 10:2001;487.
7. Zweben C. 1992;15.
8. Jedamzik R., Neubrand A., Roedel J. J. Mater. Sci. 35:2000;477.
9. Skorokhod V.V., Solonin S.M., Chernyshev L.I., Khurtsidze G.S. Sov. Powder Metall. Met. Ceram. 15:1976;273.
10. Akiyoshi N, Nakada K, Koda K, Yamabe H, Nakayama M. Copper-tungsten alloys and their manufacturing methods, US Patent 5889220, 30 March 1999.
11. Dykhuizen R.C., Smith M.F. J. Thermal Spray Technol. 7:1998;205.