Novel silicon containing polymers as photoresist materials for extreme UV lithography

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5039 II, Issue , 2003, Pages 1204-1211

  Kwark, Young Je ^a   Bravo Vasquez, J Pablo ^a   Ober, Christopher K ^a   Cao, Heidi B ^b   Deng, Hai ^b   Meagley, Robert ^b  

^a School of Chemical and Molecular Engineering   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

Chemical amplification; EUV lithography; Polysilane; Ring opening metathesis polymerization; Silicon containing polymer

Indexed keywords

COMPLEXATION; COPOLYMERIZATION; INTERFEROMETRY; MOLECULAR WEIGHT; ORGANIC POLYMERS; RING OPENING POLYMERIZATION; SILICON COMPOUNDS; SYNTHESIS (CHEMICAL); ULTRAVIOLET RADIATION;

ACID SENSITIVE MONOMERS; CHEMICALLY AMPLIFIED POLYSILANE-COPOLYMERS; NORBORNENES; PHOTORESIST MATERIALS; POLYMER PLATFORMS; RING OPENING METATHESIS POLYMERIZATION;

PHOTORESISTS;

EID: 0141722617     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.485184     Document Type: Conference Paper

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