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Volumn , Issue , 2003, Pages 39-43
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Reliability Ground Rules Change at <50 μm Pitch
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Author keywords
[No Author keywords available]
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Indexed keywords
BONDING;
INTERMETALLICS;
RELIABILITY;
WIRE;
ARTIFICIAL INTELLIGENCE;
CASTING;
ELECTRONIC COOLING;
ELECTRONICS PACKAGING;
HEATING;
INDUSTRIAL ELECTRONICS;
MANUFACTURE;
MORPHOLOGY;
TEMPERATURE CONTROL;
TESTING;
WIRE BONDING;
SEMICONDUCTOR DEVICE MANUFACTURE;
WIRE;
BONDING PROCESS;
ELECTRONICS COOLING;
HIGH-YIELD MANUFACTURING;
INTERMETALLIC FORMATION;
PROCESS CAPABILITIES;
PROCESS IMPROVEMENT;
SHAPE CONTROL;
TEST REQUIREMENTS;
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EID: 0141676825
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (10)
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References (6)
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