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Volumn 11, Issue 8, 2002, Pages 33-37
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Flip chip underfill: A guide for successful processes
a
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Author keywords
[No Author keywords available]
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Indexed keywords
CAPILLARITY;
CHIP SCALE PACKAGES;
CRACK INITIATION;
FORCED CONVECTION;
HEAT PUMP SYSTEMS;
HEAT TRANSFER;
HEATING;
MOISTURE;
OPTIMIZATION;
PROCESS CONTROL;
SENSORS;
STRESSES;
THERMAL EXPANSION;
VISCOSITY;
FLIP CHIP UNDERFILLS;
FLIP CHIP DEVICES;
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EID: 0036685602
PISSN: 10650555
EISSN: None
Source Type: Trade Journal
DOI: None Document Type: Article |
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Times cited : (2)
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References (0)
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