Residual stress in plasma-sprayed hydroxyapatite coating measured by the material removal method

Journal of Materials Science Letters

Volumn 22, Issue 13, 2003, Pages 919-922

  Yang, Y C ^a   Chang, E ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); CHEMICAL BONDS; MECHANICAL VARIABLES MEASUREMENT; MELTING; PLASMA SPRAYING; PROTECTIVE COATINGS; RESIDUAL STRESSES; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; THICKNESS MEASUREMENT; X RAY DIFFRACTION ANALYSIS;

BACKSCATTERING ELECTRON IMAGE; HYDROXYAPATITE COATING; MATERIAL REMOVAL METHOD; TRANSCORTICAL PLUG PUSHOUT;

HYDROXYAPATITE;

EID: 0043268738     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1024653807220     Document Type: Article

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