Evaluation of electrolytic nickel-phosphorus finish for applications in electronics

Plating and Surface Finishing

Volumn 90, Issue 7, 2003, Pages 31-35

  Fan, C ^a   Xu, C ^b   Kudrak, E J ^b   Abys, J A ^b  

^a Enthone Inc   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; CORROSION PROTECTION; ELECTROLYSIS; ELECTRONIC EQUIPMENT; FINISHING; NICKEL; PHOSPHORUS; SURFACE TREATMENT;

SURFACE FINISHING;

ELECTRODEPOSITION;

EID: 0043204233     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

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2. E.J. Kudrak, J.A. Abys & F. Humiec, Plating and Surface Finishing, 84, 32 (January 1997).
3. J.P. Celis, J.R. Roos & C. Fan, Trans. IMF, 69, 15 (February 1991).
4. J.A. Abys & C. Fan, US Patent 6, 335, 107 (January 2002).
5. P.K. Ng, D.D. Snyder & J. LaSala, J. Eleclrochem. Soc., 135, 1376 (June 1988).
6. E. Vafaei-Makhsoos, E.L. Thomas & L.E. Toth, Metall. Trans. A, 9, 1449 (1978).
7. E. Toth-Kadar, I. Bakonyi, A. Solyom, J. Herring, G. Konczos & F. Pavlyak, Surface and Coating Technology, 31, 31 (1987).
8. J. Vanhumbeeck, G. Ide & J.Cl. Puippe, Metalloberfläche, 43, No.9 (1990).