Evolution of microstructure in TiC/NiCr cermet induced by electropulsing

Journal of Materials Research

Volumn 18, Issue 7, 2003, Pages 1543-1550

  Zhang, W ^a   Sui, M L ^a   Zhou, Y Z ^a   Guo, J D ^a   He, G H ^a   Li, D X ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CURRENT DENSITY; GRAIN BOUNDARIES; HIGH RESOLUTION ELECTRON MICROSCOPY; METALLOGRAPHIC MICROSTRUCTURE; NANOSTRUCTURED MATERIALS; NICKEL ALLOYS; THERMAL EFFECTS; THERMAL STRESS; TITANIUM CARBIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ELECTROPULSING; NANOCRYSTALLITES; NICKEL CHROMIUM CERMET;

CERMETS;

EID: 0043199503     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2003.0213     Document Type: Article

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