Suppression of multi-path couplings in MCM with a flip-chipped SiGe-MMIC

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2002, Pages 1385-1388

  Nishino, Tamotsu ^a   Maeda, Kenichi ^a   Shimozawa, Mitsuhiro ^a   Ikushima, Takayuki ^a   Sadahiro, Keiichi ^a   Katsura, Takatoshi ^a   Suematsu, Noriharu ^a   Itoh, Kenji ^a   Oohashi, Hideyuki ^a   Takagi, Tadashi ^a   Ishida, Osami ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CERAMIC MATERIALS; COMPUTER SIMULATION; COUPLED CIRCUITS; DIELECTRIC MATERIALS; ELECTROMAGNETIC WAVES; INTERFERENCE SUPPRESSION; MATHEMATICAL MODELS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE STRUCTURES; SUBSTRATES;

ANTI PARALLEL DIODE PAIR; BIAS CIRCUIT; COUPLING PATHS; GROUND PADS; GROUND PATTERNS; ISOLATION PROPERTY; LOW TEMPERATURE CO-FIRED CERAMIC; MAXIMUM AVAILABLE GAIN; MULTICHIP MODULE;

FLIP CHIP DEVICES;

EID: 0036063402     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. A high efficiency 0.25 um CMOS PA with LTCC multi-layer high-Q integrated passive for 2.4 GHz ISM band
2. A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology
3. A low-power direct conversion receiver module for C-band wireless application
4. Silicon-Germanium BiCMOS technology for RF/analog/mix-signal application
5. A passive-type even harmonic quadrature mixer using simple filter configuration for direct conversion receiver
6. Integrated even harmonic type direct conversion receiver for W-CDMA mobile terminals (invited paper)
7. An even harmonic mixer using self biased anti parallel diode pair