The effect of the Ti glue layer in an integrated Ti/TiN/Ti/AlSiCu/TiN contact metallization process

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 4, 1996, Pages 2627-2636

  Ouellet, L ^a  

^a Mitel Networks Corporation   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0043009065     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.588997     Document Type: Article

References (15)

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