The effect of an oxygen plasma exposure on the reliability of a Ti/TiN contact metallization

Journal of Applied Physics

Volumn 79, Issue 8, 1996, Pages 4438-4443

  Ouellet, L ^a   Tremblay, Y ^a   Gagnon, G ^b   Caron, M ^b   Currie, J F ^b   Gujrathi, S C ^b   Biberger, M ^c   Reynolds, R ^c  

^a Mitel Networks Corporation   (Canada)

^b ÉCOLE POLYTECHNIQUE DE MONTRÉAL   (Canada)

^c VARIAN MEDICAL SYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0042007366     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.361753     Document Type: Article

References (14)

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