Effects of thermal residual stress creeping on microstructure and tensile properties of SiC whisker reinforced aluminum matrix composite

Materials Science and Engineering: A

Volumn 356, Issue 1-2, 2003, Pages 17-22

  Fei, W D ^a   Hu, M ^a   Yao, C K ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Tensile strength; Thermal residual stress; Yield strength

Indexed keywords

COMPOSITE MATERIALS; CRYSTAL WHISKERS; INTERFACES (MATERIALS); MICROSTRUCTURE; QUENCHING; RESIDUAL STRESSES; SILICON CARBIDE; YIELD STRESS;

THERMAL RESIDUAL STRESS CREEPING (TRSC);

MATERIALS SCIENCE;

CREEP; FIBER REINFORCED COMPOSITE; MICROSTRUCTURAL PROPERTY; SILICON CARBIDE FIBER; STRESS; TENSILE PROPERTY; WHISKER;

EID: 0042974299     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(02)00827-4     Document Type: Article

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