Simultaneous measurements of thermal expansion and thermal conductivity of FRPs by employing a hybrid measuring head on a GM refrigerator

Cryogenics

Volumn 43, Issue 8, 2003, Pages 451-458

  Kanagaraj, S ^a   Pattanayak, S ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY   (India)

Author keywords

GM refrigerator; Instrumentation; Simultaneous measurement; Thermal conductivity; Thermal expansion

Indexed keywords

CAPACITANCE; ELECTRIC CONTACTS; MAGNETIC FLUX; REFRIGERATORS; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

CONTINUOUS FLOW CRYOSTATS;

FIBER REINFORCED PLASTICS;

EID: 0042766283     PISSN: 00112275     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0011-2275(03)00101-2     Document Type: Article

References (25)

1. Hall C.A., Spond D.E. Low thermal flux glass-fibre tubing for cryogenic service. Adv. Cryog. Eng. 22:1977;214-223.
2. Hertz J., Haskins J.F. Thermal conductivity of reinforced plastics at cryogenic temperatures. Adv. Cryog. Eng. 10:1965;163-170.
3. Rhodes B.L., Moeller C.E., Sauer H.J. An apparatus for determining thermal conductivity of solids from 20 to 600 K. Cryogenics. 5:1965;17-20.
4. Khalil A. Thermal conductivity and diffusivity measurements at cryogenic temperatures by double specimen technique. Cryogenics. 22:1982;310-312.
5. Bhowmick T., Pattanayak S. Experimental setup for the study of thermal conductivity of elastomeric material at cryogenic temperature. Cryogenics. 29:1989;463-466.
6. Tseng C.-J., Yamaguchi M., Ohmori T. Thermal conductivity of polyurethane foams from room temperature to 20 K. Cryogenics. 37:1997;305-312.
7. Oram R.J., Wolff E.G. Simple guarded hot plate technique for making thermal conductivity measurements of composite materials at cryogenic temperatures. Adv. Cryog. Eng. (Mater.). 44:1998;349-357.
8. Pattanayak S., Raja Raman V.S., Kanagaraj S. Insulating property of polyurethane-Kevlar composites at low temperature. Int. Plastics Eng. Technol. 4:2000;47-58.
9. Pattanayak S, Kanagaraj S. Measurements of thermal conductivity of glass reinforced material at cryogenic temperature. In: Proceedings of Beijing International Conference on Cryogenics, October 2000, p. 181-4.
10. Kanagaraj S, Pattanayak S. Effect of volume fraction on thermal conductivity of the epoxy/glass composites at cryogenic temperature. In: Proceedings of 26th International Thermal Conductivity Conference and 14th International Thermal Expansion Symposium, August 2001, in press.
11. Bijl D., Pullan H. A new method for measuring the thermal expansion of solids at low temperatures; the thermal expansion of copper and aluminium and the Gruneisen rule. Physica. 21:1955;285-298.
12. White G.K. Measurement of thermal expansion at low temperatures. Cryogenics. 1:1961;151-158.
13. Tilford C.R., Swenson C.A. Thermal expansions of solid argon, krypton and xenon above 1 K. Phys. Rev. B. 5(2):1972;719-732.
14. Kroegner F.R., Swenson C.A. Absolute linear thermal-expansion measurements on copper and aluminum from 5 to 320 K. J. Appl. Phys. 48(3):1977;853-864.
15. Pott R., Schefzyk R. Apparatus for measuring the thermal expansion of solids between 1.5 and 380 K. J. Phys. E. 16:1983;444-449.
16. Subrahmanyam H.N., Subramanyam S.V. Accurate measurements of thermal expansion of solids between 77 and 350 K by 3-terminal capacitance method. Pramana, J. Phys. 27(5):1986;647-660.
17. Horvatic V., Gladic J., Vucic Z., Milat O. An assessment of a new type of capacitance dilatometer for measurement of the thermal expansion of solids between 273 and 620 K. Meas. Sci. Technol. 2:1991;381-388.
18. Pattanayak S, Kanagaraj S. Thermal contraction of FRPs and its measurement at cryogenic temperature. In: Proceedings of Beijing International Conference on Cryogenics, October 2000, p. 185-9.
19. Kanagaraj S, Pattanayak S. Theoretical and experimental determination of thermal expansion of glass reinforced composites at cryogenic temperature. In: Proceedings of 26th ITCC and 14th International Thermal Expansion Symposium, August 2001, in press.
20. Kanagaraj S., Pattanayak S. Measurement of thermal expansion of metals and FRPs. Cryogenics. 43(7):2003;399-424.
21. Timmerhaus K.D., Flynn T.M. Cryogenics Process Engineering. 1989;Plenum Press, New York.
22. Zelman I.M. Development of organic sealants for applications at cryogenic temperatures. Adv. Cryog. Eng. 9:1963;153-160.
23. Okaji M., Yamada N., Kato H., Nara K. Measurements of linear thermal expansion coefficients of copper SRM 736 and some commercially available coppers in the temperature range 20-300 K by means of an absolute interferometric dilatometer. Cryogenics. 37(5):1997;251-254.
24. Hahn T.A. Thermal expansion of copper from 20 to 800 K-standard reference material 736. J. Appl. Phys. 41(13):1970;5096-5101.
25. White G.K. Thermal expansion of reference materials: copper, silica and silicon. J. Phys. D, Appl. Phys. 6:1973;2070-2078.