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Volumn , Issue , 1996, Pages 1032-1038
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Thermal and viscoelastic characterization of transfer-molded epoxy encapsulant during simulated post-mold cure
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Author keywords
[No Author keywords available]
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Indexed keywords
CHARACTERIZATION;
CURING;
DIMENSIONAL STABILITY;
ENCAPSULATION;
EPOXY RESINS;
MOLDS;
SHRINKAGE;
SPECIFICATIONS;
THERMOANALYSIS;
TRANSFER MOLDING;
VISCOELASTICITY;
DYNAMIC MECHANICAL ANALYSIS;
EPOXY ENCAPSULANT;
EPOXY MOLD COMPOUND;
FLEXURAL STORAGE MODULUS;
MECHANICAL STABILITY;
POST MOLD CURE PROCESS;
RESIDUAL CURE SHRINKAGE;
THERMOMECHANICAL ANALYSIS;
TRANSFER MOLDED ENCAPSULANTS;
ELECTRONICS PACKAGING;
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EID: 0029720474
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (7)
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References (8)
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