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Volumn 2, Issue , 2003, Pages 875-880

Microprocessor power management integration by VRB-CPU approach

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; FREQUENCIES; VOLTAGE REGULATORS;

EID: 0042658180     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (5)

References (10)
  • 1
    • 0042759733 scopus 로고    scopus 로고
    • Intel technology VR roadmap
    • Edward Stanford "Intel Technology VR Roadmap," Intel Symposium 2001.
    • (2001) Intel Symposium
    • Stanford, E.1
  • 2
    • 0033343078 scopus 로고    scopus 로고
    • Power distribution system design methodology and capacitor selection for modern CMOS technology
    • Aug.
    • Larry Smith, Raymond Anderson, Doug Forehand, Tom Pelc, Tanmoy Roy, "Power distribution system design methodology and capacitor selection for modern CMOS technology," IEEE Transactions on Advanced Packaging, vol. 22, no. 3, Aug. 1999.
    • (1999) IEEE Transactions on Advanced Packaging , vol.22 , Issue.3
    • Smith, L.1    Anderson, R.2    Forehand, D.3    Pelc, T.4    Roy, T.5
  • 4
    • 0036647552 scopus 로고    scopus 로고
    • Critical inductance in voltage regulator modules
    • July
    • Pit-Leong Wong, F.C. Lee, Peng Xu, Kaiwei Yao, "Critical inductance in voltage regulator modules," IEEE Transactions on Power Electronics, vol. 17, no. 4, pp.485 -492, July 2002.
    • (2002) IEEE Transactions on Power Electronics , vol.17 , Issue.4 , pp. 485-492
    • Wong, P.-L.1    Lee, F.C.2    Xu, P.3    Yao, K.4
  • 7
    • 0035422108 scopus 로고    scopus 로고
    • Resonant free power network design using extended adaptive voltage positioning (EAVP) methodology
    • Aug.
    • Alex Waizman and Chee-Yee Chung, "Resonant Free Power Network Design Using Extended Adaptive Voltage Positioning (EAVP) Methodology." IEEE Transactions on Advanced Packaging, vol. 24, no. 3, Aug. 2001.
    • (2001) IEEE Transactions on Advanced Packaging , vol.24 , Issue.3
    • Waizman, A.1    Chung, C.-Y.2
  • 8
    • 0035699395 scopus 로고    scopus 로고
    • Design oriented analysis of package power distribution system considering target impedance for high performance microprocessors
    • Mandhana, O.P., "Design oriented analysis of package power distribution system considering target impedance for high performance microprocessors," Electrical Performance of Electronic Packaging, pp.273, 2001.
    • (2001) Electrical Performance of Electronic Packaging , pp. 273
    • Mandhana, O.P.1
  • 9
    • 0032598945 scopus 로고    scopus 로고
    • 0.35mm, 43mw/cm2, 6mw power MOSFET to power future microprocessor
    • Nick X. Sun, Alex Q. Huang and F. C. Lee, "0.35mm, 43mw/cm2, 6mw Power MOSFET to Power Future Microprocessor," ISPSD'99, pp. 77- 80.
    • ISPSD'99 , pp. 77-80
    • Sun, N.X.1    Huang, A.Q.2    Lee, F.C.3
  • 10
    • 0036045264 scopus 로고    scopus 로고
    • Design of a 4 MHz, 5V to IV monolithic voltage regulator chip
    • Nick X. Sun, Xiaoming Duan, Xin Zhang, Alex. Huang and Fred C. Lee, "Design of a 4 MHz, 5V to IV Monolithic Voltage Regulator Chip," ISPSD2002, pp.217-220.
    • ISPSD2002 , pp. 217-220
    • Sun, N.X.1    Duan, X.2    Zhang, X.3    Huang, A.4    Lee, F.C.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.