Influence of moisture-uptake on mechanical properties of polymers used in microelectronics

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 359-364

  Buchhold, R ^a   Nakladal, A ^a   Gerlach, G ^a   Sahre, K ^a   Eichhorn, K J ^a   Herold, M ^a   Gauglitz, G ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; MECHANICAL PROPERTIES; MICROELECTRONIC PROCESSING; MOISTURE; POLYIMIDES; SEMICONDUCTOR DEVICE MANUFACTURE; SILICA; SORPTION; STRESSES; SWELLING; THERMODYNAMIC STABILITY; THIN FILMS;

IN PLANE SWELLING; MECHANICAL STABILITY; MOISTURE UPTAKE; OUT OF PLANE SWELLING; POLYMER FILMS; VOLUME EXPANSION;

POLYMERS;

EID: 0032305398     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-359     Document Type: Conference Paper

References (10)