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Volumn 5231, Issue , 2003, Pages 79-84

Design and manufacturing of integrated modules for wireless and RF applications using Multi-Mix® Microtechnology and Green Tape™ LTCC materials

Author keywords

GaAs; Green Tape ; Low temperature cofired ceramic (LTCC); Mixers; MMIC; Multi Mix ; Packaging

Indexed keywords

CAPACITANCE; CAPACITORS; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; RESISTORS; THERMAL CONDUCTIVITY; WIRELESS TELECOMMUNICATION SYSTEMS;

EID: 0042329743     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (2)

References (6)
  • 1
    • 0042658644 scopus 로고    scopus 로고
    • Advanced embedded passives technologies - Putting ceramic components into organic PWB's
    • Felten, J. J. "Advanced Embedded Passives Technologies - Putting Ceramic Components into Organic PWB's" ECWC9 Paper IPC31, October 2002, Cologne Germany
    • ECWC9 Paper IPC31, October 2002, Cologne Germany
    • Felten, J.J.1
  • 2
    • 3042644169 scopus 로고    scopus 로고
    • Cost effective solutions for high density interconnect and RF modules using low temperature cofired ceramic materials
    • Needes, C.R.S., Amey D.I. and Horawitz S.J. "Cost Effective Solutions for High Density Interconnect and RF Modules Using Low Temperature Cofired Ceramic Materials" IMC/IEMT Conference, April 2000
    • IMC/IEMT Conference, April 2000
    • Needes, C.R.S.1    Amey, D.I.2    Horawitz, S.J.3
  • 5
    • 0043159561 scopus 로고    scopus 로고
    • Hittite Microwave Corporation, HMC264 Product Specification sheet
    • Hittite Microwave Corporation, HMC264 Product Specification sheet.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.