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Volumn 5231, Issue , 2003, Pages 79-84
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Design and manufacturing of integrated modules for wireless and RF applications using Multi-Mix® Microtechnology and Green Tape™ LTCC materials
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Author keywords
GaAs; Green Tape ; Low temperature cofired ceramic (LTCC); Mixers; MMIC; Multi Mix ; Packaging
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Indexed keywords
CAPACITANCE;
CAPACITORS;
ELECTRIC INDUCTORS;
ELECTRONICS PACKAGING;
MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;
RESISTORS;
THERMAL CONDUCTIVITY;
WIRELESS TELECOMMUNICATION SYSTEMS;
LOW TEMPERATURE COFIRED CERAMIC TECHNOLOGIES;
WIRELESS APPLICATIONS;
INTEGRATED CIRCUIT LAYOUT;
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EID: 0042329743
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (2)
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References (6)
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