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Volumn 1, Issue , 2000, Pages 12-18
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Engineering science considerations for integration and packaging
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Author keywords
[No Author keywords available]
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Indexed keywords
INTEGRATED CIRCUIT MANUFACTURE;
POWER ELECTRONICS;
SEMICONDUCTOR DEVICE MANUFACTURE;
DRIVE CIRCUITRY;
ELECTRONICS PACKAGING;
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EID: 0034472858
PISSN: 02759306
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (19)
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References (13)
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