Nondestructive examination of epoxy adhesive-bonded structures exposed to a humid environment: A comparison of low- and high-frequency dielectric measurements

Journal of Adhesion

Volumn 78, Issue 11, 2002, Pages 967-985

  Comrie, Robert ^a   Affrossman, Stanley ^a   Hayward, David ^a   Pethrick, Richard A ^a  

^a UNIVERSITY OF STRATHCLYDE   (United Kingdom)

Author keywords

Ageing aluminium joints; Dielectric examination; Epoxy resins; Joints

Indexed keywords

DIELECTRIC PROPERTIES; ELECTRIC VARIABLES MEASUREMENT; EPOXY RESINS; HYDRATION; MOISTURE; MOLECULES; NONDESTRUCTIVE EXAMINATION; OXIDES; PLASTIC ADHESIVES; POLARIZATION; THICK FILMS; WATER;

DIELECTRIC MEASUREMENTS; EPOXY ADHESIVE BONDED STRUCTURES;

ADHESIVE JOINTS;

EID: 0042123804     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218460214509     Document Type: Article

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