Investigation of moisture ingress into adhesive bonded structures using high frequency dielectric analysis

Journal of Materials Science

Volumn 32, Issue 4, 1997, Pages 879-886

  Li, Zhi Cheng ^a   Hayward, D ^a   Gilmore, R ^b   Pethrick, R A ^a  

^a UNIVERSITY OF STRATHCLYDE   (United Kingdom)

^b DEFENCE SCIENCE AND TECHNOLOGY LABORATORY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ALUMINUM; ANODIC OXIDATION; BONDING; DIELECTRIC PROPERTIES; FREQUENCY DOMAIN ANALYSIS; HIGH TEMPERATURE EFFECTS; INTERFACES (MATERIALS); MECHANICAL TESTING; MOISTURE; SHEAR STRENGTH; TIME DOMAIN ANALYSIS;

HIGH FREQUENCY DIELECTRIC ANALYSIS; PLASTICIZATION;

ADHESIVE JOINTS;

EID: 0031076026     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1018593331158     Document Type: Article

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