Optimization of Bosch etch process for through wafer interconnects

Biennial University/Government/Industry Microelectronics Symposium - Proceedings

Volumn , Issue , 2003, Pages 338-339

  Kenoyer, Linda ^a   Oxford, Rex ^a   Moll, Amy ^a  

^a Boise State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ETCHING; MICROMETERS; SULFUR HEXAFLUORIDE CIRCUIT BREAKERS;

WAFER INTERCONNECTS;

SILICON WAFERS;

EID: 0041939914     PISSN: 07496877     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Robert Bosch Gmbh, U.S. Patent 4,855,017 and 4.784,420
2. A. Ayon, R. Braff, R. Bayt, H. Sawin, and M. Schmidt, J. Electrochemical Society, 146, 339(1999)
3. Walker, M., Proc. SPIE MEMS Conf., 89, (2001)