The effect of substrate on the microstructure and tensile properties of electrodeposited nanocrystalline nickel

Materials Characterization

Volumn 49, Issue 5, 2002, Pages 373-379

  Ebrahimi, Fereshteh ^a   Ahmed, Zunayed ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

Electrodeposition; Grain size; Nanocrystals; Nickel (Ni); Strength; Substrate

Indexed keywords

ANNEALING; COLD ROLLING; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; METALLOGRAPHIC MICROSTRUCTURE; NICKEL; NUCLEATION; PARTICLE SIZE ANALYSIS; TENSILE STRENGTH; TEXTURES;

CO-DEPOSITION PROCESSES;

NANOSTRUCTURED MATERIALS;

EID: 0041914661     PISSN: 10445803     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1044-5803(02)00305-4     Document Type: Article

References (14)

1. Ebrahimi F., Kong D., Matthews T.E., Zhai Q. Processing of metallic nanostructures by electrodeposition techniques. Srivastan T.S., Khor K.A. Processing and fabrication of advanced materials VII. 1998;509-521 TMS Publication, Warrendale (PA).
2. Ebrahimi F., Bourne G.R., Kelly M.S., Matthews T.E. Mechanical properties of nanocrystalline nickel produced by electrodeposition. Nanostruct. Mater. J. 11(3):1999;343-350.
3. El-Sherik A.M., Erb U. Synthesis of bulk nanocrystalline nickel by pulsed electrodeposition. J. Mater. Sci. Eng. 30(3):1995;5743-5749.
4. Osaka T., Takai M., Hayashi K., Ohashi K., Saito M., Yamada K. A soft magnetic CoNiFe film with high saturation magnetization and low coercivity. Nature. 392(3):1998;796-798.
5. Walsh F.C., Herron M.E. Electrocrystallization and electrochemical control of crystal growth: fundamental considerations and electrodeposition of metals. J. Phys. D - Appl. Phys. 24(3):1991;217-225.
6. Oniciu L., Mureşan L. Some fundamental aspects of leveling and brightening in metal electrodeposition. J. Appl. Electrochem. 21(3):1991;565-574.
7. Merchant H.D. Defect structure of electrodeposits. Mercahnt H.D. Defect structure, morphology and properties of deposits. 1995;1-59 TMS Publication, Warrendale (PA).
8. Ebrahimi F., Ahmed Z., Morgan K.L. Effect of grain size distribution on tensile properties of electrodeposited nanocrystalline nickel. MRS Proceedings. 634(3):2001;B.2.7.1-B.2.7.6.
9. Budevski E., Staikov G., Lorenz W.J. Electrochemical phase formation and growth. 1996;149-199 VCH, Weinheim.
10. Ebrahimi F., Zhai Q., Kong D. Deformation and fracture of electrodeposited copper. Scr. Mater. 39(3):1998;315-321.
11. Amblard J., Epelboin I., Forment M., Maurin G. Inhibition and nickel electrocrystallization. J. Appl. Electrochem. 9(3):1979;233-242.
12. Mitra R., Ungar T., Morita T., Sanders P.G., Weertman J.R. Assessment of grain size distribution in nanocrystalline copper and their effect on mechanical behavior. Liaw P.K.et al. The 1999 J.R. Weertman Symposium. 1999;553-564 TMS Publication, Warrendale (PA).
13. Wilsdorf HGF. The investigation of the fracture of titanium alloys by in-situ and analytical microstructural techniques. Report No. UVA/5253/MS88/103, Office of Naval Research, 1988.
14. Nakahara S., Okinaka Y. Microstructure and ductility of electroless copper deposits. Acta Metall. 31(5):1983;713-724.