Coupled package-device modeling for microelectromechanical systems

Microelectronics Reliability

Volumn 40, Issue 7, 2000, Pages 1235-1241

  Bart, Stephen F ^a   Zhang, Susan ^a   Rabinovich, Vladimir L ^a   Cunningham, Shawn ^b  

^a Microcosm Technologies Inc   (United States)

^b Ford Microelectronics Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROACTUATORS; MICROELECTROMECHANICAL DEVICES; MICROSENSORS; STRAIN; STRESS ANALYSIS;

APPLICATION SPECIFIC PACKAGING;

ELECTRONICS PACKAGING;

EID: 0034228701     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00010-X     Document Type: Article

References (9)

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