Constrained-sintered material systems for interconnects and packages

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5231, Issue , 2003, Pages 126-131

  Needes, Christopher R ^a   Wang, Carl B ^a   Hang, Kenneth W ^a   Barker, Michael F ^a   Amey, Daniel I ^a   Smith, Michael A ^a   Souders, Kenneth E ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FIRING (OF MATERIALS); LOW TEMPERATURE OPERATIONS; OPTICAL INTERCONNECTS; PRESSURE EFFECTS; SHRINKAGE; SINTERING; SUBSTRATES;

CONSTRAINED SINTERED MATERIAL SYSTEMS; GREEN CERAMIC LAMINATE; LOW TEMPERATURE CO-FIRED CIRCUITS; PRESSURE ASSISTED PROCESS;

CERAMIC MATERIALS;

EID: 0041328251     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. K.R. Mikeska, D.T. Schaefer, R.H.Jensen, "Method for Reducing Shrinkage During Firing of Green Ceramic Bodies," U.S. Pat. No. 5,085,720 Feb 4, 1992
2. K.R. Mikeska, D.T. Schaefer, "Method for reducing Shrinkage During Firing of Ceramic Bodies," U.S. Pat. No. 5,254,191, Oct 19, 1993
3. K.R. Mikeska, D.T. Schaefer, "Green Ceramic Composite and Method for Making Such Composite," U.S. Pat. No. 5,387,474, Feb 7, 1995
4. M.F. Barker, R.R. Draudt, "Zero Shrink Process for Cost Sensitive High Volume LTCC Applications" IMAPS Proceedings, pp. 26-31, 2001
5. Patent pending
6. Patent pending