Copper nanowires electrodeposited in etched single-ion track templates

Applied Physics A: Materials Science and Processing

Volumn 77, Issue 6, 2003, Pages 751-755

  Enculescu, I ^a,b   Siwy, Z ^a,c   Dobrev, D ^a   Trautmann, C ^a   Toimil Molares, M E ^a   Neumann, R ^a   Hjort, K ^d   Westerberg, L ^e   Spohr, R ^a  

^a GSI HELMHOLTZZENTRUM FÜR SCHWERIONENFORSCHUNG GMBH   (Germany)

^b NATIONAL INSTITUTE OF MATERIALS PHYSICS   (Romania)

^c SILESIAN UNIVERSITY OF TECHNOLOGY   (Poland)

^d UPPSALA UNIVERSITY   (Sweden)

^e UPPSALA UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC PROPERTIES; ELECTRODEPOSITION; ETCHING; LITHOGRAPHY; SCANNING ELECTRON MICROSCOPY;

SINGLE-ION TRACK TEMPLATES;

NANOSTRUCTURED MATERIALS;

EID: 0041321172     PISSN: 09478396     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00339-003-2216-3     Document Type: Article

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