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Volumn 10, Issue 7, 1998, Pages 405-412

Application of harmonic finite element analysis to a CMOS heat-capacity measurement structure

Author keywords

Finite elements; Harmonic analysis; Heat capacity; Material characterization; Microsystem modeling

Indexed keywords


EID: 0041021966     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (5)

References (6)
  • 1
    • 0038955593 scopus 로고    scopus 로고
    • Thermoelectric test structures to measure the heat capacity of CMOS layer sandwiches
    • Chicago, June
    • M. von Arx, O. Paul and H. Baltes: Thermoelectric Test Structures to Measure the Heat Capacity of CMOS Layer Sandwiches, Digest of Technical Papers of Transducers 97 (Chicago, June 1997).
    • (1997) Digest of Technical Papers of Transducers , vol.97
    • Von Arx, M.1    Paul, O.2    Baltes, H.3
  • 5
    • 0003924231 scopus 로고    scopus 로고
    • ETH PhD Thesis No. 11567 Physical Electronics Laboratory, Zurich
    • D. Jaeggi: Thermal Converters by CMOS Technology, ETH PhD Thesis No. 11567 (Physical Electronics Laboratory, Zurich, 1996).
    • (1996) Thermal Converters by CMOS Technology
    • Jaeggi, D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.