Thermal curing in polyimide films and coatings

Polyimides: Fundamentals and Applications

Volumn , Issue , 2018, Pages 207-247

  Coburn, John C ^a   Pottiger, Michael T ^a  

^a DUPONT COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATINGS; DIELECTRIC MATERIALS; INJECTION MOLDING; INTEGRATED CIRCUIT INTERCONNECTS; MICROELECTRONICS; MULTICHIP MODULES; PASSIVATION;

COMPOSITE APPLICATIONS; HIGH DENSITY INTERCONNECTS; HIGH MOLECULAR WEIGHT; HISTORICAL DEVELOPMENT; INTER-LAYER DIELECTRICS; LOW DIELECTRIC CONSTANTS; PACKAGING APPLICATIONS; THERMOPLASTIC POLYIMIDE;

POLYIMIDES;

EID: 85052906929     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1201/9780203742945     Document Type: Chapter

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