Effect of grinding method on bending strength of silicon nitride

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 42, Issue 4, 1999, Pages 560-567

  Sakaida, Yoshihisa ^a   Tanaka, Keisuke ^b  

^a JAPAN FINE CERAMICS CENTER   (Japan)

^b NAGOYA UNIVERSITY   (Japan)

Author keywords

Ceramics; Face Grinding Method; Grinding Flaw; Residual Stress; Surface Grinding Method; X Ray Stress Measurement

Indexed keywords

BENDING STRENGTH; CERAMIC MATERIALS; COMPRESSIVE STRESS; CRACKS; FRACTURE TOUGHNESS; GRINDING (COMMINUTION); RESIDUAL STRESSES; STRESS CONCENTRATION;

FACE GRINDING METHOD; GRINDING FLAW SIZE; STRESS SHIELDING EFFECT; SURFACE GRINDING METHOD; X RAY STRESS MEASUREMENT;

SILICON NITRIDE;

EID: 0039973965     PISSN: 13447912     EISSN: None     Source Type: Journal    
DOI: 10.1299/jsmea.42.560     Document Type: Article

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