The influence of mask substrate thickness on exposure and development times for the LIGA process

Microsystem Technologies

Volumn 6, Issue 3, 2000, Pages 99-102

  Griffiths, S K ^a   Ting, A ^a   Hruby, J M ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039930297     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050006     Document Type: Article

References (5)

1. Becker EW; Ehrfeld W; Hagmann P; Maner A; Munchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA Process). Microelectronic Eng 4: 35-56
2. Munchmeyer D; Ehrfeld W (1987) Accuracy limits and potential applications of the LIGA technique in integrated optics. Proceedings of the SPIE, Micromachining of Elements with Optical and other Submicrometer Dimensional and Surface Specification 803: 72-79
3. Freiertag G; Ehrfeld W; Lehr H; Schmidt A; Schmidt M (1998) Calculation and experimental determination of the structure transfer accuracy in deep X-ray lithography. J Micromech Microeng 7 (4): 323-331
4. Tan MX; Bankert MA; Griffiths SK; Ting A; Boehme DR; Wilson S; Balser LM (1998) PMMA dose studies at various synchrotron sources and exposure/development conditions. Proceedings of the SPIE, Materials and Device Characterization in Micromachining, 3512
5. Griffiths SK; Hruby JM; Ting A (1999) Optimum doses and mask thickness for synchrotron exposure of PMMA resists. Proceedings of the SPIE, Design, Test and Microfabrication of MEMS and MOEMS, 3680: 498-507