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Nihon Reoroji Gakkaishi

Volumn 27, Issue 4, 1999, Pages 235-241

Viscoelastic behavior of an epoxy compound with high fillers during cure

(3) Kuroki, Motohiro a Takahashi, Hideaki b Ishimuro, Yoshitaka b

a TORAY INDUSTRIES INC (Japan)

b TORAY RESEARCH CENTER INC (Japan)

Author keywords

Cure; Epoxy resin; Gelation; Simulation; Viscosity

Indexed keywords

EID: 0038928871 PISSN: 03871533 EISSN: None Source Type: Journal
DOI: 10.1678/rheology.27.235 Document Type: Article

Times cited : (3)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.