Thermal/fluid characteristics of 3-D woven mesh structures as heat exchanger surfaces

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 40-47

  Wirtz, R A ^a   Xu, Jun ^a   Park, Ji Wook ^a   Ruch, Dan ^a  

^a University of Nevada   (United States)

Author keywords

Heat exchange; Thermal fluid; Woven mesh

Indexed keywords

BONDING; COOLANTS; HEAT TRANSFER; SURFACES; THERMAL CONDUCTIVITY; THREE DIMENSIONAL; WEAVING; WIRE;

HEAT EXCHANGER SURFACES; THREE DIMENSIONAL WOVEN MESH STRUCTURES;

HEAT EXCHANGERS;

EID: 0038819134     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.811476     Document Type: Article

References (11)

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