In-plane effective thermal conductivity of plain-weave screen laminates

IEEE Transactions on Components and Packaging Technologies

Volumn 25, Issue 4, 2002, Pages 615-620

  Xu, Jun ^a,b   Wirtz, Richard A ^a  

^a University of Nevada   (United States)

^b Purdue University   (United States)

Author keywords

Plain weave; Porosity; Screen laminates; Thermal conductivity

Indexed keywords

ANISOTROPY; BENCHMARKING; COPPER; HEAT TRANSFER; MATHEMATICAL MODELS; MATRIX ALGEBRA; POROSITY; POROUS MATERIALS; THERMAL CONDUCTIVITY; THERMAL DIFFUSION; VECTORS;

PLAIN-WEAVE SCREEN LAMINATES;

LAMINATED COMPOSITES;

EID: 0036999763     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.807993     Document Type: Conference Paper

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