Mixed convection cooling of horizontally mounted printed circuit board

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 126-133

  Kehoe, Emily ^a   Davies, Mark ^b   Newport, David ^b  

^a INTEL CORPORATION   (United States)

^b UNIVERSITY OF LIMERICK   (Ireland)

Author keywords

Component interaction; Heat transfer; Interferometry; Mixed convection; PCB; PIV

Indexed keywords

COMPUTER SIMULATION; COOLING; ELECTRONICS PACKAGING; HELIUM NEON LASERS; INTERFEROMETERS; INTERFEROMETRY; MIXED CONVECTION; MONOCHROMATORS; NUSSELT NUMBER; PRANDTL NUMBER; REYNOLDS NUMBER; VELOCITY MEASUREMENT;

ELECTRONIC COOLING; GRASHOF NUMBERS; HORIZONTAL RIBS; PARTICLE IMAGE VELOCIMETRY; SUPER BALL GRID ARRAY;

PRINTED CIRCUIT BOARDS;

EID: 0038819119     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.811471     Document Type: Article

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