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Volumn 51, Issue 13, 2003, Pages 3939-3950
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Formation mechanism of texture during dynamic recrystallization in γ-TiAl, nickel and copper examined by microstructure observation and grain boundary analysis based on local orientation measurements
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Author keywords
Dynamic recrystallization; Electron backscattered diffraction (EBSD); Texture; Twinning
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Indexed keywords
DEFORMATION;
GRAIN BOUNDARIES;
MICROSTRUCTURE;
RECRYSTALLIZATION (METALLURGY);
TEXTURES;
TWINNING;
GRAIN BOUNDARY MIGRATION;
TITANIUM ALLOYS;
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EID: 0038789074
PISSN: 13596454
EISSN: None
Source Type: Journal
DOI: 10.1016/S1359-6454(03)00218-0 Document Type: Article |
Times cited : (78)
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References (29)
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