Characterization of boundary conditions during thermoplastic composite tape lay-up process using an inverse method

Modelling and Simulation in Materials Science and Engineering

Volumn 11, Issue 4, 2003, Pages 417-426

  Kim, Sun K ^a,b   Kim, Hee June ^a,c   Lee, Woo Il ^a  

^a Seoul National University   (South Korea)

^b NORTHWESTERN UNIVERSITY   (United States)

^c UNIVERSITY OF DELAWARE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; FINITE ELEMENT METHOD; HEAT TRANSFER; OPTIMIZATION; THERMOPLASTICS;

INVERSE METHOD;

COMPOSITE MATERIALS;

EID: 0038782118     PISSN: 09650393     EISSN: None     Source Type: Journal    
DOI: 10.1088/0965-0393/11/4/301     Document Type: Article

References (12)

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4. Kim H J, Kim S K and Lee W I 2003 J. Thermoplast. Compos. at press
5. Beck J V, Blackwell B and St Clair C R Jr 1985 Inverse Heat Conduction (New York: Wiley)
6. ICI Thermoplastic Composites 1991 Thermoplastic Composites Materials Handbook ICI Thermoplastic Composites, Cininnati, USA
7. Kim H J 1999 Analyses of tape lay-up process of thermoplastic composite PhD Dissertation Seoul National University
8. Oden J T 1981 Finite Elements an Introduction vol I (London: Prentice-Hall)
9. Hughes T J R and Brooks A 1982 Finite Element Fluid 14 199
10. Visual Numerics 1997 IMSL Math/Library User's Guide
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