A study on heat transfer during thermoplastic composite tape lay-up process

Experimental Thermal and Fluid Science

Volumn 13, Issue 4, 1996, Pages 408-418

  Kim, Hee June ^a   Kim, Sun Kyung ^a   Lee II, Woo ^a  

^a Seoul National University   (South Korea)

Author keywords

Lay up speed; Nozzle exit temperature; Nozzle mass flow rate; Prepreg tape; Thermoplastic composite tape lay up process

Indexed keywords

COMPOSITE MATERIALS; COMPUTER SIMULATION; COMPUTER SOFTWARE; FINITE ELEMENT METHOD; MASS TRANSFER; NOZZLES; TEMPERATURE MEASUREMENT; THERMOCOUPLES; THERMOPLASTICS;

LAY UP SPEED; NOZZLE EXIT TEMPERATURE; NOZZLE MASS FLOW RATE; PREPREG TAPES; TAPE LAY UP PROCESS;

HEAT TRANSFER;

HEAT TRANSFER; SIMULATION-NUMERICAL; THERMOPLASTICS;

EID: 0030292048     PISSN: 08941777     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0894-1777(96)00095-7     Document Type: Article

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