Effect of additives on the removal efficiency of photoresist by ozone/DI-water processes: Experimental study

Solid State Phenomena

Volumn 92, Issue , 2003, Pages 101-104

  Vankerckhoven, H ^a   De Smedt, F ^a   Claes, M ^b   De Gendt, S ^b   Heyns, M M ^b   Vinckier, C ^a  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b IMEC   (Belgium)

Author keywords

Kinetics; Ozone; Photoresist stripping; Transfer

Indexed keywords

ADDITIVES; COMPOSITION EFFECTS; HIGH TEMPERATURE EFFECTS; HYDROCHLORIC ACID; NITROGEN OXIDES; OXIDATION; OZONE; PH EFFECTS; REACTION KINETICS; SULFURIC ACID; AMMONIUM HYDROXIDE; CHLORINE COMPOUNDS; ENZYME KINETICS; PHOTORESISTS;

OZONE SPRAY TOOL; SPIKING; STRIP RATE; TETRAMETHYLAMMONIUM HYDROXIDE; HIGH TEMPERATURE; KINETICALLY CONTROLLED; OXIDIZING SPECIES; PHOTORESIST STRIPPING; PROCESS WATER; REMOVAL EFFICIENCIES; TETRAMETHYL AMMONIUM HYDROXIDE; TRANSFER;

PHOTORESISTS; OZONE;

EID: 0038745359     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/ssp.92.101     Document Type: Conference Paper

References (4)

1. S. De Gendt, P. Snee, I. Cornelissen et al., Proc. of the 4th int. symp. on ultra clean processing of silicon surfaces p. 165, Solid State Phenomena 65/66, 1999.
2. Bergman E., Castle H., Melli, M., Magrin, M., "Photoresist Strip Process Using Ozone Diffusion through a Controlled Aqueous Boundary Layer", Cleaning Technology in Semiconductor Device Manufacturing VI, (Proc.), ed., R.E. Novak, J. Ruzyllo and T. Hattori. 3999-406, 1999.
3. De Gendt S., Lux M, Claes M., Van Hoeymissen J. et al., "Evaluation of Ozonated Water Spray for Resist Cleaning Applications", Cleaning Technology in Semiconductor Device Manufacturing VI (Proc.), ed. R. E. Novak, J. Ruzyllo and T. Hattori, 391-398, 2000.
4. F. De Smedt, S. De Gendt, M. M. Heyns and C. Vinckier. Applications of ozone in semiconductor cleaning processes: the solubility issue, J. Electrochem. Soc., 149, G487-G493, 2001.